Patent Number: 6,309,505

Title: Substrate processing apparatus and method

Abstract: One wafer is placed on a wafer support table with its frontside facing upward, and the other wafer is chucked by a wafer chuck portion with its frontside facing upward. The wafer chuck portion is pivoted about a shaft through about 180.degree. to make the two wafers face each other substantially parallel. In response to the cancel of the chucking of the upper wafer by the wafer chuck portion, the central portion of the upper wafer is pressed by a press pin to superimpose the two wafers.

Inventors: Takisawa; Toru (Atsugi, JP), Yonehara; Takao (Atsugi, JP), Yamagata; Kenji (Sagamihara, JP)

Assignee: Canon Kabushiki Kaisha

International Classification: H01L 21/67 (20060101); H01L 21/00 (20060101); H01L 21/687 (20060101); B65G 049/07 ()

Expiration Date: 10/30/2018