Patent Number: 6,309,516

Title: Method and apparatus for metal allot sputtering

Abstract: A method and apparatus for sputter deposition of metal alloys with improved compositional uniformity is provided, wherein a first, narrow width target is provided with a sputtering surface comprised of a metal alloy including metal elements having different angular distributions of sputtered atoms, and a wider width substrate having a deposition surface is moved past the sputtering surface, whereby the deposition surface traverses all arrival angles of the sputtered atoms thereby compensating for the different angular distributions of the sputtered atoms. The inventive methodology finds particular utility in the manufacture of magnetic and magneto-optical (MO) recording media.

Inventors: McLeod; Paul Stephen (Berkeley, CA)

Assignee: Seagate Technology LLC

International Classification: C23C 14/35 (20060101); C23C 14/34 (20060101); C23C 14/56 (20060101); H01J 37/32 (20060101); H01J 37/34 (20060101); C23C 014/34 ()

Expiration Date: 10/30/2018