Patent Number: 6,309,525

Title: Sputtering apparatus capable of changing distance between substrate and deposition preventing plate used for film formation

Abstract: A sputtering apparatus for forming a sputtered film on a substrate held on a substrate holder in a vacuum chamber includes a target, a deposition preventing plate provided between the target and the substrate holder, a substrate holder carrying mechanism, and a moving mechanism for moving the substrate holder carrying mechanism to change a distance between the substrate and the deposition preventing plate.

Inventors: Futagawa; Masayasu (Nabari, JP), Mito; Kiyoshi (Uda-gun, JP)

Assignee: Sharp Kabushiki Kaisha

International Classification: C23C 14/34 (20060101); C23C 14/56 (20060101); C23C 14/50 (20060101); H01J 37/32 (20060101); H01J 37/34 (20060101); C23C 014/04 (); C23C 014/34 ()

Expiration Date: 10/30/2018