Patent Number: 6,309,528

Title: Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes

Abstract: A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a two-step process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

Inventors: Taylor; E. Jennings (Troy, OH), Sun; Jenny J. (Tipp City, OH), Inman; Maria E. (Englewood, OH)

Assignee: Faraday Technology Marketing Group, LLC

International Classification: C25D 5/18 (20060101); C25D 5/00 (20060101); H05K 3/42 (20060101); H05K 3/46 (20060101); C25D 005/18 ()

Expiration Date: 10/30/2018