Patent Number: 6,309,560

Title: Chemical mechanical polishing slurry useful for copper substrates

Abstract: A chemical mechanical polishing slurry comprising a film forming agent, urea hydrogen peroxide, a complexing agent, an abrasive, and an optional surfactant, as well as a method for using the chemical mechanical polishing slurry to remove copper alloy, titanium, and titanium nitride containing layers from a substrate.

Inventors: Kaufman; Vlasta Brusic (Geneva, IL), Kistler; Rodney C. (St. Charles, IL), Wang; Shumin (Naperville, IL)

Assignee: Cabot Microelectronics Corporation

International Classification: C09G 1/00 (20060101); C09G 1/02 (20060101); H01L 21/02 (20060101); H01L 21/321 (20060101); H01L 021/302 ()

Expiration Date: 10/30/2018