Patent Number: 6,309,575

Title: Transfer molding method for forming integrated circuit package

Abstract: A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.

Inventors: Boutin; Lynda (Waterloo, CA), Letourneau; Martial A. (Granby, CA), Tetreault; Real (Granby, CA)

Assignee: International Business Machines Corporation

International Classification: B29C 45/02 (20060101); B29C 70/00 (20060101); B29C 70/70 (20060101); B29C 070/70 (); B29C 045/02 ()

Expiration Date: 10/30/2018