Patent Number: 6,309,591

Title: Apparatus for bonding a particle material to near theoretical density

Abstract: An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The apparatus may further be used to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.

Inventors: Yoo; Sang H. (Fairfax, VA), Sethuram; Krupashankara M. (Falls Church, VA), Sudarshan; Tirumalai S. (Vienna, VA)

Assignee: Materials Modification, Inc.

International Classification: B22F 3/00 (20060101); B22F 3/14 (20060101); C04B 35/64 (20060101); B22F 003/14 (); B22F 007/04 ()

Expiration Date: 10/30/2018