Patent Number: 6,309,692

Title: Method of and apparatus for coating a substrate with a coating material having an even thickness

Abstract: A substrate is placed on a support surface of a table. The support surface has a flatness of 2 .mu.m or less. The table has a plurality of holes in the surface. A vacuum is created in the holes to bring the substrate into close contact with the support surface. This eliminates deformations of the substrate, such as twisting and curving. A coating die is moved above the table to apply a coating material onto the substrate. Consequently, a coating having a constant thickness is formed on the substrate.

Inventors: Nakamura; Masahiro (Kashiba, JP), Yokoyama; Takuya (Takatsuki, JP), Nishio; Tsutomu (Kashiwara, JP)

Assignee: Chugai RO Co., Ltd.

International Classification: B05C 5/02 (20060101); B05C 11/02 (20060101); B05D 1/26 (20060101); B05D 001/26 ()

Expiration Date: 10/30/2018