Patent Number: 6,309,737

Title: Circuit substrate

Abstract: A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a layer comprising Al and Cu.

Inventors: Hirashima; Yutaka (Omuta, JP), Taniguchi; Yoshitaka (Omuta, JP), Hushii; Yasuhito (Omuta, JP), Tujimura; Yoshihiko (Omuta, JP), Terano; Katsunori (Omuta, JP), Gotoh; Takeshi (Omuta, JP), Takakura; Syoji (Omuta, JP), Yoshino; Nobuyuki (Omuta, JP), Sugimoto; Isao (Machida, JP), Miyai; Akira (Machida, JP)

Assignee: Denki Kagaku Kogyo Kabushiki Kaisha

International Classification: C04B 37/02 (20060101); H01L 23/12 (20060101); H01L 23/34 (20060101); H01L 23/373 (20060101); H01L 23/15 (20060101); H05K 3/38 (20060101); B32B 003/00 ()

Expiration Date: 10/30/2018