Patent Number: 6,309,791

Title: Polyimide precursor, polyimide and their use

Abstract: A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.

Inventors: Hagiwara; Hideo (Ibaraki-ken, JP), Kojima; Yasunori (Hitachi, JP), Kaji; Makoto (Hitachi, JP), Kojima; Mitsumasa (Niiza, JP), Kikkawa; Haruhiko (Yokohama, JP)

Assignee: Hitachi Chemical Co.

International Classification: C08G 73/00 (20060101); C08G 73/10 (20060101); G03F 7/032 (20060101); G03F 7/038 (20060101); G03F 7/037 (20060101); H05K 1/00 (20060101); G03F 007/075 (); G03F 007/038 (); G03F 007/40 ()

Expiration Date: 10/30/2018