Patent Number: 6,309,897

Title: Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die

Abstract: A method and an apparatus providing a circuit edit structure to an integrated circuit enabling circuit edits to be performed through the back side of an integrated circuit die. In one embodiment, a passive diffusion is disposed in the substrate of a flip-chip packaged integrated circuit die. A plurality of contacts couple the passive diffusion to a signal line disposed in a dielectric isolation layer of the integrated circuit die. In another embodiment, the signal line includes an uninterrupted length of approximately 3.0 microns beneath a field oxide region in the integrated circuit die, which provides a circuit edit cut location. The passive diffusion and circuit edit cut locations may be accessed through the back side of the flip-chip packaged integrated circuit, which enable circuit edits to be performed on the flip-chip packaged integrated circuit.

Inventors: Livengood; Richard H. (Los Gatos, CA)

Assignee: Intel Corporation

International Classification: H01L 21/70 (20060101); H01L 23/52 (20060101); H01L 21/768 (20060101); H01L 23/48 (20060101); H01L 23/525 (20060101); H01L 021/66 ()

Expiration Date: 10/30/2018