Patent Number: 6,309,899

Title: Method and system for removing a die from a semiconductor package

Abstract: A method and system for removing a die from a semiconductor package is disclosed. The semiconductor package includes the die and a ceramic base. The die has a first face, a second face and a plurality of sides. The second face of the die is coupled with the ceramic base. The method and system include covering at least the first face and a portion of the plurality of sides of the die with a hard wax and encapsulating the hard wax and at least a first portion of the ceramic base in a resin. The method and system also include removing at least a second portion of the ceramic base to expose the second face of the die and removing the hard wax to free the die.

Inventors: Mahanpour; Mehrdad (Union City, CA), Hulog; Jose (San Jose, CA)

Assignee: Advanced Micro Devices, Inc.

International Classification: H01L 21/67 (20060101); H01L 21/68 (20060101); H01L 21/66 (20060101); H01L 021/66 (); G01R 031/26 ()

Expiration Date: 10/30/2018