Patent Number: 6,309,908

Title: Package for an electronic component and a method of making it

Abstract: An electrical 100 and a method of making the package is disclosed. Specifically the package 100 contains a lid 101 with at least one opening 105 through the lid 101 into a cavity 180 surrounding the die 120 between the lid 101 and the substrate 130 of the package 100. Underfill material 150 is injected through the opening 105 to at least partially fill the cavity 180 to prevent both vertical and horizontal die cracking and to provide a more reliable package.

Inventors: Sarihan; Vijay (Paradise Valley, AZ), Mercado; Lei L. (Gilbert, AZ)

Assignee: Motorola, Inc.

International Classification: H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 23/16 (20060101); H01L 23/24 (20060101); H01L 021/44 (); H01L 021/48 (); H01L 021/50 ()

Expiration Date: 10/30/2018