Patent Number: 6,309,910

Title: Microelectronic components with frangible lead sections

Abstract: Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The lead is formed by depositing a layer of lead forming material over an irregularity provided on a supporting substrate so as to provide a region of altered crystal morphology. The region of altered crystal morphology provides the lead with the weakened region.

Inventors: Haba; Belgacem (Cupertino, CA), Raab; Kurt (Phoenix, AZ)

Assignee: Tessera Inc.

International Classification: H01L 23/48 (20060101); H01L 21/60 (20060101); H01L 21/02 (20060101); H01L 21/48 (20060101); H01L 23/495 (20060101); H01L 23/498 (20060101); H01L 021/44 (); H01L 021/48 (); H01L 021/50 (); H01L 021/301 ()

Expiration Date: 10/30/2018