Patent Number: 6,309,914

Title: Method for making a semiconductor package

Abstract: A method for making a semiconductor package is provided for removing from the semiconductor package excess encapsulant formed by molding compound solidified in the runners and gates of a mold after transfer molding is completed without damaging the semiconductor package. A separator is used to be mounted on a BGA substrate of the semiconductor package for the excess encapsulant to attach thereon, so that the substrate requires no cleaning treatment after transfer molding is completed. In the method, the semiconductor chip is firstly adhered to and electrically connects with the substrate. The substrate with the semiconductor chip is then mounted with the separator having at least one opening for receiving the semiconductor chip, thereby the runners and gates of the mold are positioned over the separator instead of the substrate during transfer molding, allowing the excess encapsulant to attach to the separator. The presence of the separator thus eliminates damages to the substrate caused by the removal of excess encapsulant from the separator and reduces the manufacturing cost of the semiconductor chip for that the separator is capable of repetitive use.

Inventors: Huang; Chien-Ping (Taichung, TW), Ke; Chun-Chi (Taichung, TW)

Assignee: Siliconware Precision Industrices Co., Ltd.

International Classification: H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 021/44 (); H01L 021/48 (); H01L 021/50 ()

Expiration Date: 10/30/2018