Patent Number: 6,309,916

Title: Method of molding plastic semiconductor packages

Abstract: In the manufacture of semiconductor packages having molded plastic bodies, the plating of all of the surfaces of the molding tool that comes into contact with the molten resin during molding with a nodular thin dense chromium ("NTDC") coating prevents the surfaces from adhering to the package body and ensures good package release, without formation of cracks or craters in the package body. This, in turn, permits the amount of both release agents and adhesion promoters used in the molding compound to be substantially reduced, or eliminated altogether, thereby resulting in a package body having improved strength and adhesion with the components of the package, and hence, an improved resistance of the package body to the propagation of cracks and its subsequent penetration by moisture.

Inventors: Crowley; Sean T. (Phoenix, AZ), Cheney; Gerald L. (Chandler, AZ), Razu; David S. (Gilbert, AZ)

Assignee: Amkor Technology, Inc

International Classification: B29C 45/37 (20060101); B29C 45/40 (20060101); B29C 45/14 (20060101); H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 021/44 (); H01L 021/48 (); H01L 021/50 (); H01L 023/12 (); H01L 023/053 (); H01L 023/28 (); A23G 001/22 (); A23G 003/12 (); A23G 003/16 (); A23P 001/00 (); B21C 003/00 (); B23B 019/00 (); B23B 023/00 (); B23B 003/10 (); A01J 021/00 (); A01J 025/12 (); A21C 011/00 (); A21C 003/00 (); B28B 011/00 (); B28B 021/00 ()

Expiration Date: 10/30/2018