Patent Number: 6,309,943

Title: Precision marking and singulation method

Abstract: A method includes identifying and determining a position of a scribe grid on a front-side surface of a wafer with a camera. Based on this information, a laser is fired to form an alignment mark on the back-side surface of the wafer. Advantageously, the alignment mark is positioned with respect to the scribe grid to within tight tolerance. The wafer is then cut from the backside surface using the alignment mark as a reference. Of importance, the wafer is cut from the back-side surface thus protecting the front-side surface of the wafer. Of further importance, the wafer is precisely cut such that the scribe line is not fabricated with the extra large width of scribe lines of conventional wafers designed to be cut from the back-side surface.

Inventors: Glenn; Thomas P. (Gilbert, AZ), Webster; Steven (Chandler, AZ), Swiss; Gary L. (Gilbert, AZ)

Assignee: Amkor Technology, Inc.

International Classification: H01L 21/02 (20060101); H01L 21/48 (20060101); H01L 23/544 (20060101); H01L 021/76 ()

Expiration Date: 10/30/2018