Patent Number: 6,309,954

Title: Methods of forming flip chip bumps and related flip chip bump constructions

Abstract: Methods of forming flip chip bumps and related flip chip bump constructions are described. In one implementation, a bump of conductive material is formed over a substrate. At least a portion of the bump is dipped into a volume of conductive flowable material, with some of the flowable material remaining over the bump. The remaining flowable material over the bump is solidified and includes an outermost surface the entirety of which is outwardly exposed. In another implementation, the outermost surface include an uppermost generally planar surface away from the substrate. The solidified flowable material together with the conductive material of the bump provide a bump assembly having a height which is greater than the height of the original bump. The increased height is achieved without meaningfully increasing a width dimension of the bump proximate the substrate.

Inventors: Lake; Rickie C. (Eagle, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 21/60 (20060101); H01L 21/02 (20060101); H01L 021/44 ()

Expiration Date: 10/30/2018