Patent Number: 6,310,019

Title: Cleaning agent for a semi-conductor substrate

Abstract: This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. The said cleaning agent and the method have made it possible to control a speed of etching on silicone oxide so as to remove impurities adsorbed on copper wirings and silicone oxide on a surface of a semi-conductor substrate having copper wirings on its surface, such as copper oxides and particles, without causing corrosion or oxidation of copper wirings nor causing roughness on the surface.

Inventors: Kakizawa; Masahiko (Saitama, JP), Umekita; Ken-ichi (Saitama, JP), Hayashida; Ichiro (Saitama, JP)

Assignee: Wako Pure Chemical Industries, Ltd.

International Classification: C11D 1/835 (20060101); C11D 11/00 (20060101); H01L 21/02 (20060101); H01L 21/321 (20060101); C11D 1/38 (20060101); C11D 1/72 (20060101); C11D 1/62 (20060101); C11D 1/722 (20060101); C11D 001/835 (); H01L 021/306 ()

Expiration Date: 10/30/2018