Patent Number: 6,310,119

Title: Film-shaped encapsulating agent for electronic parts

Abstract: The present invention provides a film-shaped encapsulating agent for electronic parts which is composed essentially of a polycarbodiimide resin and an epoxy resin or of a polycarbodiimide resin, an epoxy resin and colorant, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as determined by gel permeation chromatography and the epoxy resin is contained in a proportion of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin. The film-shaped encapsulating agent enables, for its good processability, the continuous encapsulation of electronic parts without requiring any expensive apparatus (therefore, no cost increase is incurred) and is excellent in heat resistance and electrical insulation after the encapsulation.

Inventors: Imashiro; Yasuo (Tokyo, JP), Ito; Takahiko (Tokyo, JP), Tomita; Hideshi (Tokyo, JP), Nakamura; Norimasa (Tokyo, JP)

Assignee: Nisshinbo Industries, Inc.

International Classification: C08J 5/18 (20060101); C08L 79/00 (20060101); C08L 063/00 ()

Expiration Date: 10/30/2018