Patent Number: 6,310,120

Title: Flip-chip type semiconductor device sealing material

Abstract: A sealing material comprising (A) a liquid epoxy resin, (B) a curing agent, (C) spherical silica, (D) a soft x-ray non-transmissive spherical inorganic filler, and (E) a curing accelerator is suited as an underfill material for flip-chip type semiconductor devices. The sealing material has improved thin-film infiltration and storage stability. The filled state or seal defects can be readily inspected using soft x-rays.

Inventors: Shiobara; Toshio (Gunma-ken, JP), Sumita; Kazuaki (Gunma-ken, JP)

Assignee: Shin-Etsu Chemical Co., Ltd.

International Classification: C08G 59/42 (20060101); C08G 59/00 (20060101); C08K 003/22 (); C08L 063/02 ()

Expiration Date: 10/30/2018