Patent Number: 6,310,135

Title: Polyimide resin composition

Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5'-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Inventors: Tanaka; Akira (Kanagawa, JP), Tazaki; Satoshi (Kanagawa, JP), Yoneda; Yasuhiro (Kanagawa, JP), Yokouchi; Kishio (Kanagawa, JP)

Assignee: Nippon Zeon Co., Ltd.

International Classification: C08G 73/00 (20060101); C08G 73/10 (20060101); C08K 5/00 (20060101); C08K 5/3472 (20060101); G03F 7/038 (20060101); H05K 3/28 (20060101); C08L 039/00 (); C08G 073/10 ()

Expiration Date: 10/30/2018