Patent Number: 6,310,167

Title: Ethylene homopolymer and its molded article

Abstract: Provided are an ethylene homopolymer having well-balanced properties of good heat resistance, good heat-sealability and good moldability, and its molded articles. The ethylene homopolymer is characterized in that the number of butyl branches per 100 methyl branches therein falls between 1 and 20, as measured through .sup.13 C-NMR, that its density, d (kg/m.sup.3), falls between 880 and 980, and that the density, d, and its melting point, Tm (.degree. C.) , satisfy the conditions defined by the following formulae (1) to (3): The ethylene homopolymer is molded into moldings.

Inventors: Kanzawa; Mitsugu (Ichihara, JP), Okuda; Fumio (Ichihara, JP), Housaki; Tatsuya (Ichihara, JP), Tatsumi; Tomio (Ichihara, JP)

Assignee: Idemitsu Petrochemical Co., Ltd.

International Classification: C08F 110/02 (20060101); C08F 110/00 (20060101); C08F 010/02 (); C08F 110/02 (); C08F 004/70 ()

Expiration Date: 10/30/2018