Patent Number: 6,310,298

Title: Printed circuit board substrate having solder mask-free edges

Abstract: A substrate for a plurality of electronic assemblies includes a strip of printed circuit board (PCB) material including a surface and a plurality of segments. Each segment is adapted to receive at least one electronic component and is arranged to be singulated into a plurality of individual electronic assemblies. Each segment has a perimeter portion located generally about the periphery of the segment, with the surface being covered with a solder mask, except for the perimeter portion.

Inventors: Barrett; Joseph C. (El Dorado, CA), Jamieson; Mark P. (Folsom, CA)

Assignee: Intel Corporation

International Classification: H01L 21/02 (20060101); H01L 21/48 (20060101); H01L 23/498 (20060101); H01L 23/48 (20060101); H05K 3/34 (20060101); H05K 3/00 (20060101); H05K 001/03 ()

Expiration Date: 10/30/2018