Patent Number: 6,310,301

Title: Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same

Abstract: An inter-substrate conductive mount for a surface mountable circuit board, a method of manufacturing the circuit board and a surface mountable power magnetic device. In one embodiment, the circuit board includes: (1) a substrate, (2) an inter-substrate conductive mount composed of a material having a melting point above a solder reflow temperature and including a compliant solder joint at an interface of the substrate and (3) a solder located proximate the conductive mount, the conductive mount of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the conductive mount in contact with the substrate as the solder is brought to the reflow temperature, the conductive mount being capable of mounting the substrate to an adjacent substrate and providing a conductive path therebetween.

Inventors: Heinrich; Randy T. (Dallas, TX), Roessler; Robert J. (Rowlett, TX), Truong; Thang D. (Grand Prairie, TX), Wilkowski; Matthew A. (Mesquite, TX), Woods, Jr.; William L. (Kaufman, TX)


International Classification: H05K 3/34 (20060101); H05K 3/36 (20060101); H05K 1/16 (20060101); H05K 1/14 (20060101); H05K 001/16 ()

Expiration Date: 10/30/2018