Patent Number: 6,310,303

Title: Structure for printed circuit design

Abstract: A substrate structure for surface mount devices, including a plurality of substrate layers including at least a base layer and an outer layer; the base layer having a contact surface and a first array of conductive elements on the contact surface; the outer layer having a contact surface, a second array of conductive elements on the contact surface, and at least one access passing through the outer layer and the outer layer being mounted to the base layer with the access positioned over the first array, wherein the first array and the second array define in combination a device mounting site.

Inventors: Luvara; John J. (D14, Stamford, CT), Quigley, Jr.; John J. (Wallingford, CT), Prasad; Ray (Portland, OR)


International Classification: H01L 23/52 (20060101); H01L 23/538 (20060101); H05K 3/34 (20060101); H05K 1/18 (20060101); H01R 012/04 (); H05K 001/11 ()

Expiration Date: 10/30/2018