Patent Number: 6,310,304

Title: Electronic part fabricated by intaglio printing

Abstract: A pattern, in which a groove of an optional position is deeper than that of the other portion, is formed on a surface of a flexible resin sheet by laser process, and then a release layer is formed on the surface of the thus obtained pattern, thereby forming an intaglio plate. The intaglio plate is filled with Ag paste and then dried. The intaglio plate is then laminated onto an insulating substrate, on which a thermoplastic resin layer is formed using heat rollers. Thereafter, the intaglio plate is peeled from the insulating substrate so that the pattern of the Ag paste is transferred thereon, and the conductor pattern is formed through burning. Further, an insulating layer is formed so as to cover the conductor pattern and another conductor pattern is formed on the insulating layer, whereby forming a multilayered structure. In some cases, a difference in height of the lower layer conductor pattern is provided and the higher portion thereof functions as a via hole electrode for electrically connecting the lower and upper conductor patterns.

Inventors: Hayama; Masaaki (Nara, JP), Mohri; Noboru (Katano, JP), Nakao; Keiichi (Hirakata, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: H05K 3/20 (20060101); H05K 3/46 (20060101); H05K 1/16 (20060101); H05K 1/03 (20060101); H05K 1/09 (20060101); H01R 009/09 ()

Expiration Date: 10/30/2018