Patent Number: 6,310,323

Title: Water cooled support for lamps and rapid thermal processing chamber

Abstract: A heating assembly for heating a semiconductor substrate in a processing chamber of a reactor includes a plurality of heater supports and a plurality of heating devices supported by the heater supports. The heater supports provide conductive paths for the heating devices for coupling the heating devices to an external power source and, further, are adapted to cool the heating devices whereby the heating devices may be operated at a high power output while maintaining the temperature of the heating devices below a maximum temperature. Preferably the heater supports are cooled by a coolant system, for example a coolant system which circulates coolant through at least a portion of the heater supports to thereby cool the heater supports and the heating devices.

Inventors: Mahawili; Imad (Grand Rapids, MI), Arend; John M. (Belmont, MI)

Assignee: Micro C Technologies, Inc.

International Classification: H01L 21/00 (20060101); F27B 005/14 ()

Expiration Date: 10/30/2018