Patent Number: 6,310,371

Title: Fingerprint sensor chip

Abstract: The present invention provides a fingerprint sensor chip formed on a dielectric layer of a semiconductor wafer. The fingerprint sensor chip comprises a plurality of rectangular sensor areas arranged in a matrix format which are surrounded by conductors, a second dielectric layer covering the sensor areas and the conductors wherein the surface of the second dielectric layer positioned above each of the sensor areas is formed as a protruding rectangular platform with a shallow trench around the platform, a rectangular metal plate positioned on top of each of the rectangular platforms which is used as a sensor plate of the fingerprint sensor chip, and a protective layer positioned on the surface of the semiconductor wafer to cover and protect the underlying circuitry.

Inventors: Hung; Tz-Ian (Hsin-Ying, TW)

Assignee: United Microelectronics Corp.

International Classification: H01L 29/66 (20060101); H01L 29/82 (20060101); H01L 27/14 (20060101); H01L 29/84 (20060101); H01L 027/14 (); H01L 029/82 (); H01L 029/84 ()

Expiration Date: 10/30/2018