Patent Number: 6,310,389

Title: Semiconductor package

Abstract: A method of manufacturing a semiconductor package including the steps ofadhering inner leads to a semiconductor chip surface via an insulatingadhesive, forming an insulating layer on the semiconductor chip and uppersurfaces of the inner leads such that bonding pads formed on thesemiconductor chip and portions of the inner leads are exposed through anopening, forming a conductive layer in the opening to electrically connectthe bonding pads to the inner leads, and forming a semiconductor packageby molding the semiconductor chip, the inner leads, the insulating layer,and the conductive layer with a molding material.

Inventors: Han; Seong-young (Yongin, KR)


International Classification:

Expiration Date: 10/32013