Patent Number: 6,310,390

Title: BGA package and method of fabrication

Abstract: A BGA package and a method for fabricating the package are provided. The package includes a semiconductor die, internal conductors wire bonded to bond pads on the die, external ball contacts attached to ball bonding pads formed on the conductors in a dense grid pattern, and an encapsulating resin encapsulating the die and conductors. The package is fabricated using a lead frame having lead fingers that form the conductors. The die is back bonded to a polymer tape placed across the lead fingers, and then wire bonded to bonding pads on the conductors. In addition, the encapsulating resin is molded to include openings for the ball contacts which are aligned with the ball bonding pads. An alternate embodiment BGA package includes a polymer substrate adhesively bonded to a face of the die. The polymer substrate includes conductors having beam leads aligned with an opening through the polymer substrate. The opening provides access for a bonding tool for bonding bumps on the beam leads to bond pads on the die.

Inventors: Moden; Walter (Meridian, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 21/02 (20060101); H01L 23/28 (20060101); H01L 21/56 (20060101); H01L 23/495 (20060101); H01L 23/31 (20060101); H01L 23/498 (20060101); H01L 23/48 (20060101); H01C 023/495 ()

Expiration Date: 10/30/2018