Patent Number: 6,310,393

Title: Electric circuit and package for semiconductor

Abstract: The semiconductor package of this invention includes: a semiconductorelement having a power supply terminal, a ground terminal, and an outputterminal; an inductance; and a capacitance. One of opposing terminals ofthe capacitance is connected to the power supply terminal of thesemiconductor element, and the other terminal is connected to the groundterminal of the semiconductor element. The ground terminal of thesemiconductor element is connected to a ground terminal of thesemiconductor package, the power supply terminal of the semiconductorelement is connected to a power supply terminal of the semiconductorpackage via the inductance, and the output terminal of the semiconductorelement is connected to an output terminal of the semiconductor package.

Inventors: Ogura; Tetsuyosi (Settsu, JP), Fukumoto; Yukihiro (Kyotanabe, JP), Iwaki; Hideki (Ibaraki, JP), Taguchi; Yutaka (Takatsuki, JP), Bessho; Yoshihiro (Higashi Osaka, JP)

Assignee:

International Classification:

Expiration Date: 10/32013