Patent Number: 6,310,395

Title: Electronic component with anodically bonded contact

Abstract: An electronic component includes an inner lead having a tip with aprojection; an insulating coating that is electrically conductive whenheated disposed around the projection; and a metallic coating disposedaround an electrode on a semiconductor chip, with a crater reaching theelectrode, the projection engaging the crater to make a contact betweenthe inner lead and the electrode, the insulating coating and the metalliccoating being anodically bonded to each other.

Inventors: Takahashi; Yoshiharu (Kikuchi-gun, JP), Shinohara; Toshiaki (Kikuchi-gun, JP)


International Classification:

Expiration Date: 10/32013