Patent Number: 6,310,403

Title: Method of manufacturing components and component thereof

Abstract: A method of manufacturing components includes providing a substrate (110, 531, 631, 700) having a first coefficient of thermal expansion (CTE), having a first surface (111), and supporting a first plurality of interconnects located over the first surface in a first predetermined pattern. The method also includes providing another substrate (190) having a second CTE, having a second surface (195), and supporting a second plurality of interconnects located over the second surface in a second predetermined pattern. The method further includes assembling together the two substrates at a first temperature outside of a temperature range of approximately 25 to C.

Inventors: Zhang; Chunsheng (Chandler, AZ), Lin; Jong-Kai (Chandler, AZ), Lindsey; Scott E. (Mesa, AZ), Guo; Yifan (Gilbert, AZ), Li; Li (Gilbert, AZ)

Assignee: Motorola, Inc.

International Classification: H01L 21/02 (20060101); H01L 21/60 (20060101); H05K 3/34 (20060101); H01L 023/48 (); H01L 023/52 (); H01L 029/40 ()

Expiration Date: 10/30/2018