Patent Number: 6,310,421

Title: Surface acoustic wave device and method for fabricating the same

Abstract: A surface acoustic wave device that is small, lightweight and highly reliable, and protects its functional portion. The surface acoustic wave device has surface acoustic wave elements mounted on a circuit substrate. Each surface acoustic wave element includes a frame-like first insulating film furnished to surround functional portions on a chip, and a lid-like second insulating film deposited on the first insulating film so as to cover driving electrodes and surface wave propagation paths of the functional portions, while securing a hollow portion over the functional portions.

Inventors: Morishima; Koji (Tokyo, JP)

Assignee: Mitsubishi Denki Kabushiki Kaisha

International Classification: H03H 3/08 (20060101); H03H 3/00 (20060101); H03H 9/05 (20060101); H01L 041/08 ()

Expiration Date: 10/30/2018