Patent Number: 6,310,484

Title: Semiconductor test interconnect with variable flexure contacts

Abstract: An interconnect for testing semiconductor components includes a substrate,and interconnect contacts on the substrate for electrically engagingterminal contacts on the components. The interconnect also includes one ormore cavities in the substrate which form flexible segments proximate tothe interconnect contacts. The flexible segments permit the interconnectcontacts to move independently in the z-direction to accommodatevariations in the height and planarity of the terminal contacts. Inaddition, the cavities can be pressurized, or alternately filled with apolymer material, to adjust a compliancy of the flexible segments.Different embodiments of the interconnect contacts include: metallizedrecesses for retaining the terminal contacts, metallized projections forpenetrating the terminal contacts, metallized recesses with penetratingprojections, and leads contained on a polymer tape and cantilevered overmetallized recesses. The interconnect can be used to construct a waferlevel test system for testing wafer sized components, such as wafers andboards, or to construct a die level test system for testing die sizedcomponents, such as unpackaged dice and chip scale packages.

Inventors: Akram; Salman (Boise, ID), Wood; Alan G. (Boise, ID)


International Classification:

Expiration Date: 10/32013