Patent Number: 6,310,525

Title: Dielectric laminated device and its manufacturing method

Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.

Inventors: Nakakubo; Hideaki (Kyoto, JP), Ishizaki; Toshio (Kobe, JP), Yamada; Toru (Katano, JP), Kagata; Hiroshi (Hirakata, JP), Inoue; Tatsuya (Takatsuki, JP), Kitazawa; Shoichi (Nishinomiya, JP)

Assignee: Matsushita Electric Industrial Co. Ltd.

International Classification: H01P 1/203 (20060101); H01P 11/00 (20060101); H01P 1/20 (20060101); H01P 7/08 (20060101); H01P 001/203 (); H01P 007/08 ()

Expiration Date: 10/30/2018