Patent Number: 6,310,533

Title: Water-resistant encapsulation of solenoid

Abstract: This invention relates to the resin encapsulation of solenoids to achieve water resistance at pressure depth. When a compatible and bondable resin is used to form a solenoid bobbin, to insulate the lead-in wires and to encapsulate the solenoid, the resulting encapsulation is effective in resisting water penetration. The formation of bonds between the encapsulation and the solenoid bobbin flanges and insulated lead-in wires allows the encapsulated solenoid to resist water penetration and to operate efficiently in underwater environments.

Inventors: Coulombier; Olivier P. (Holcomb, NY)

Assignee: Cliftronics, Inc.

International Classification: H01F 7/128 (20060101); H01F 7/08 (20060101); H01F 027/02 ()

Expiration Date: 10/30/2018