Patent Number: 6,310,771

Title: CPU heat sink

Abstract: A CPU heat sink includes a copper bottom panel, a plurality of copper radiating fins arranged in parallel on the bottom panel, the radiating fins each having a transverse foot bar, a plurality of strips respectively upwardly extended from the transverse foot bar and arranged in parallel, and a plurality of horizontal locating flanges respectively extended from the transverse foot bar at right angles, and an aluminum base molded on the bottom panel and the transverse foot bar and locating flanges of each radiating fin by die casting, the aluminum base having four upright posts disposed in four corners, the upright posts each having a square top and a screw hole on the square top, and four bearing blocks respectively fastened to the upright posts of the aluminum base and adapted to support a fan above the radiating fins, the bearing blocks each having a countersunk hole fastened to the screw hole of one upright post of the aluminum base by a screw, and at least one screw hole for the mounting of a fan.

Inventors: Chien; Chuan-Fu (Linkou Hsaing, Taipei County, TW)

Assignee:

International Classification: H01L 23/367 (20060101); H01L 23/34 (20060101); H01L 23/40 (20060101); H01L 23/467 (20060101); H05K 007/20 ()

Expiration Date: 10/30/2018