Patent Number: 6,310,773

Title: Heat sink system

Abstract: A heat dissipation system for an integrated circuit assembly uses a compressible support structure to support a cooling solution, or heat sink, that dissipates heat generated by an integrated circuit. The compressible support structure, in one embodiment, is a deformable tube that is supported by a base structure. The tube, heat sink and base can be formed from a conductive material to provide an EMI shield for the integrated circuit. Retention mechanisms are used to provide either a fixed or an adjustable compression force to place the heat sink in thermal contact with the integrated circuit. The compressible support structure supports the heat sink, but also absorbs vibration and shock forces exerted on the heat sink to reduce the amount of forces transferred to the integrated circuit.

Inventors: Yusuf; Imran (Tempe, AZ), Chandran; Biju (Chandler, AZ)

Assignee: Intel Corporation

International Classification: H01L 23/34 (20060101); H01L 23/40 (20060101); H05K 007/20 (); H05K 009/00 ()

Expiration Date: 10/30/2018