Patent Number: 6,310,780

Title: Surface mount assembly for electronic components

Abstract: A plurality of indentations 21, 22, and 23 are formed in one major surface of a printed board 1. A plurality of electrode pads 41, 42, 43, and 44 are provided on the one major surface and the bottom of the indentations. A plurality of solder portions 91, 92, 93, and 94 are formed on the respective electrode pads. A plurality of electronic components 5, 6, 7, and 8 each having a plurality of terminals are connected to the electrode pads in the corresponding indentations by means of the solder portions.

Inventors: Tamura; Koetsu (Tokyo, JP), Matsuzawa; Hajime (Tokyo, JP)

Assignee: NEC Corporation

International Classification: H05K 3/12 (20060101); H05K 3/34 (20060101); H05K 1/18 (20060101); H05K 1/11 (20060101); H05K 1/00 (20060101); H05K 003/32 (); H01L 023/12 ()

Expiration Date: 10/30/2018