Patent Number: 6,311,003

Title: Techniques for forming optical electronic integrated circuits having interconnects in the form of semiconductor waveguides

Abstract: An optical electronic integrated circuit (OEIC) having optical waveguides as device interconnects. An optical waveguide is formed by depositing, in an oxygen-free atmosphere, a film of semiconductor material on a semiconductor substrate at a temperature that substantially diminishes the porosity of the film and the diffusion of material from the substrate into the film. The semiconductor film, which has an index of refraction greater than that of the substrate, is etched to form the optical waveguide on the substrate. The substrate also supports a plurality of active optical devices between which the optical waveguide extends. The substrate is preferably formed from gallium-arsenide and the waveguide from germanium. The active devices may also include these materials as well as aluminum-gallium-arsenide.

Inventors: Dubey; Madan (South River, NJ), Jones; Kenneth A. (Brick, NJ), Han; Weiyu (Edison, NJ), West; Lawrence C. (Clarksburg, NJ)

Assignee: The United States of America as represented by the Secretary of the Army

International Classification: G02B 6/12 (20060101); G02B 6/132 (20060101); G02B 6/13 (20060101); G02B 6/10 (20060101); G02B 6/122 (20060101); G02B 6/136 (20060101); G02B 6/43 (20060101); G02B 006/10 ()

Expiration Date: 10/30/2018