Patent Number: 6,311,023

Title: Camera having a light-shieldable member for protecting a semiconductor element flip-chip-bonded on a flexible printed board

Abstract: A camera having a flexible printed board on which a semiconductor element is flip-chip-bonded, a light-shieldable member such as a housing, a lens barrel, or an outer member. An element formation surface of a semiconductor element flip-chip-bonded on the flexible printed board is arranged to oppose the light-shieldable member.

Inventors: Watanabe; Akira (Tokyo, JP)

Assignee: Olympus Optical Co., Ltd.

International Classification: G03B 17/00 (20060101); H05K 1/02 (20060101); H05K 1/18 (20060101); G03B 017/00 ()

Expiration Date: 10/30/2018