Patent Number: 6,332,268

Title: Method and apparatus for packaging IC chip, and tape-shaped carrier to beused therefor

Abstract: An IC chip (2) can be provided to a pre-mount process while being held on atape-shaped supporting member (5), without being taken out of thetape-shaped supporting member (5).

Inventors: Imanishi; Makoto (Neyagawa, JP), Kitayama; Yoshifumi (Hirakata, JP), Kumagai; Koichi (Ikoma, JP), Kanayama; Shinji (Kashihara, JP), Wada; Yoshinori (Moriguchi, JP), Yonezawa; Takahiro (Neyagawa, JP), Higashi; Kazushi (Neyagawa, JP)

Assignee:

International Classification: H01L 21/00 (20060101); H05K 003/30 ()

Expiration Date: 12/25/2014