Patent Number: 6,332,270

Title: Method of making high density integral test probe

Abstract: A high density integrated test probe and method of fabrication isdescribed. A group of wires are ball bonded to contact locations on thesurface of a fan out substrate. The wires are sheared off leaving a stub,the end of which is flattened by an anvil. Before flattening a sheet ofmaterial having a group of holes is arranged for alignment with the groupof stubs is disposed over the stubs. The sheet of material supports theenlarged tip. The substrate with stubs form a probe which is moved intoengagement with contact locations on a work piece such as a drip orpackaging substrate.

Inventors: Beaman; Brian Samuel (Hyde Park, NY), Fogel; Keith Edward (Mohegan Lake, NY), Lauro; Paul Alfred (Nanuet, NY), Norcott; Maurice H. (Fishkill, NY), Shih; Da-Yuan (Poughkeepsie, NY), Walker; George Frederick (New York, NY)

Assignee:

International Classification: G01R 1/073 (20060101); G01R 3/00 (20060101); H01R 009/14 ()

Expiration Date: 12/25/2014