Patent Number: 6,332,359

Title: Semiconductor sensor chip and method for producing the chip, andsemiconductor sensor and package for assembling the sensor

Abstract: A sensor chip having a support frame part and sensor structure including atleast one displaceable weight part, and a beam part for connecting theweight part to the support frame part. The sensor structure is formed on asilicon substrate through an insulating layer and the insulating layerbetween the sensor structure and the silicon substrate is removed. Thebeam part is formed of two parallel beams and the weight part is connectedto the support frame part by two parallel beams. At least twosemiconductor strain gauges are formed on the surface of the tworespective parallel beams. The semiconductor chip may be contained in apackage having a main surface for mounting the semiconductor sensor chipformed at a predetermined angle with respect to the surface of a printedcircuit board for mounting the package. The main surface is provided witha plurality of terminals along two opposite sides thereof for connectingwith input/output terminals of the semiconductor sensor chip. A bottomsurface perpendicular to the main surface is provided with a plurality ofpins for inserting into mounting holes of the circuit board.

Inventors: Ueyanagi; Katsumichi (Kawasaki, JP), Nishikawa; Mutsuo (Kawasaki, JP), Sasaki; Mitsuo (Kawasaki, JP)


International Classification: G01P 1/02 (20060101); G01P 21/00 (20060101); G01P 15/08 (20060101); G01P 15/11 (20060101); G01P 15/12 (20060101); G01P 1/00 (20060101); H01F 10/12 (20060101); H05K 1/18 (20060101); G01P 015/12 ()

Expiration Date: 12/25/2014