Patent Number: 6,332,568

Title: Wafer scale micromachine assembly method

Abstract: A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.

Inventors: Christenson; Todd R. (Albuquerque, NM)

Assignee: Sandia Corporation

International Classification: B23K 20/02 (20060101); B23K 020/24 (); B23K 001/20 (); B23K 031/02 ()

Expiration Date: 12/25/2018