Patent Number: 6,332,569

Title: Etched glass solder bump transfer for flip chip integrated circuit devices

Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the ""flip chip"" technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Inventors: Cordes; Steven A. (Cortlandt Manor, NY), Gruber; Peter Alfred (Mohegan Lake, NY), Kummer; Egon Max (Croton on Hudson, NY), Roux; Stephen (Purdys, NY), Sambucetti; Carlos Juan (Croton on Hudson, NY), Speidell; James Louis (Poughguag, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/60 (20060101); H01L 21/02 (20060101); H05K 3/34 (20060101); H05K 3/00 (20060101); B23K 031/02 (); B23K 035/02 ()

Expiration Date: 12/25/2018