Patent Number: 6,332,720

Title: Semiconductor laser coupling device and method for assembling the same on circuit board

Abstract: When an optical system is housed in a plastic case, an optical connection in the system might be changed by a deformation of the case due to heat and thermal resistance might be increased. It is important that the case has not only a function of housing the elements of the optical system, but also a function of ensuring that light is stably produced in the optical system, which, is the most important function of the case. Therefore, the deformation of the case due to a change in temperature is prevented by a frame inserted into the opening portion of the case and further by mounting the case on an external aluminum substrate. That is, stability in the optical connection is improved by improving the structure of the case and by mounting an case on the external substrate. Further, an increase in the thermal resistance is prevented in the same way by provision of the frame and the external aluminum substrate.

Inventors: Shimaoka; Makoto (Ushiku, JP), Ishikawa; Tadaaki (Tsuchiura, JP), Fukuda; Kazuyuki (Ibaraki-ken, JP), Kuroguchi; Katsumi (Yokohama, JP)

Assignee: Hitachi, Ltd.

International Classification: G02B 6/42 (20060101); G02B 006/36 ()

Expiration Date: 12/25/2018