Patent Number: 6,332,724

Title: Substrate processing apparatus

Abstract: Outside air taken in from the outside is cooled to a predeterminedtemperature by a cooler, and the air cooled by the cooler flows through alow temperature side flow path in a heat exchanger, whereas outside airflows through a high temperature side flow path in the heat exchanger,which allows heat to be exchanged between the cooled air and the outsideair. The air, flowing through the low temperature side flow path in theheat exchanger and warmed up by the outside air flowing through the hightemperature side flow path, is warmed and humidified by a warmer and ahumidifier, and the air with predetermined temperature and humidity issupplied to a coating processing unit. Moreover, the outside air, flowingthrough the high temperature side flow path in the heat exchanger andcooled by the air flowing through the low temperature side flow path, iswarmed by a warmer, and the air with a predetermined temperature issupplied to a developing processing unit. Thus, an apparatus forregulating the temperature and humidity of air to be supplied to thecoating processing unit and the developing processing unit can bedownsized, and running costs for electric power consumption and the likecan be reduced.

Inventors: Yano; Mitsuteru (Kumamoto-Ken, JP), Semba; Norio (Kumamoto-Ken, JP), Kanagawa; Kouzou (Kumamoto-Ken, JP), Ueda; Issei (Kumamoto-Ken, JP), Akimoto; Masami (Kumamoto-Ken, JP), Ohi; Kazuhiko (Kawasaki, JP)

Assignee:

International Classification: H01L 21/00 (20060101); G03F 7/30 (20060101); G03F 7/16 (20060101); H01L 021/027 (); G03D 005/04 ()

Expiration Date: 12/25/2014